Jiangsu Changjiang Electronics Technology Co., Ltd. engages in packaging and testing integrated circuits and discrete devices in China. It offers wafer level, system in package, flip chip, laminate, leaded, and discrete products. The company also provides design and characterization, water bump, assembly, test, and reliability examination services. Jiangsu Changjiang Electronics Technology Co., Ltd. was founded in 1972 and is based in Jiangyin, China.
Jiangsu Changjiang Electronics Technology Co., Ltd. is a China-based company, principally engaged in semiconductor business. The Company is engaged in the testing and distribution of integrated circuits and discrete devices, and chip design and manufacture of discrete devices. The company’s products are applies in computers, network communications, consumer electronics and intelligent mobile terminals, industrial automation control, power management, automotive electronics and other electronic machine and intelligent areas. The Company distributes its products within domestic markets and to overseas markets.
Products
Semiconductor >> Diode >> General Purpose Diodes
Semiconductor >> Diode >> Zener Diodes
Semiconductor >> Integrated Circuits (IC) – Analog & Mixed Signal >> ICs – Analog & Mixed Signal, Miscellaneous
Semiconductor >> Integrated Circuits (IC) – Digital >> ASICs
Semiconductor >> Transistors >> General Purpose Transistors
Semiconductor >> Transistors >> Power Transistors
Components >> Regulator >> All of Regulator
Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) specializes in semiconductor packaging assembly and test. We provide total solutions in wafer probe, package design, packaging assembly and test. JCET is the leading semiconductor packaging assembly and test subcon in China and was listed on Shanghai Stock Exchange in 2003. The company is recognized as a Key National Hi-tech Company. It hosts the National High-density IC Packaging Laboratory, a national level Enterprise Technology Center and a Postdoctoral Research Workstation. The company also founded and sponsors the National IC Packaging & Assembly Technology Innovation Strategy Alliance.